三民網路書店 / 搜尋結果

This book comprises theoretical and experimental analysis of various properties of silicon nanocrystals, research methods and preparation techniques, and some promising applications. It comprises nine

The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces

Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book

The April 1999 symposium highlights state of the art studies of integration, unit process development, and materials micro-characterization and theory as applied to the problems of submicron and deep-

The April 1995 symposium, held as part of the MRS Spring Meeting in San Francisco, emphasized materials research and development and processing issues identified in The National Technology Roadmap fo