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【簡體曬書區】 單本79折,5本7折,活動好評延長至5/31,趕緊把握這一波!

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2016年以前 (6)

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Edited by James A. Knapp 、Peter Børgesen 、Raymond A. Zuhr (1)
Edited by Peter Børgesen 、John C. Coburn 、William F. Filter 、John E. Sanchez、Jr. 、Kenneth P. Rodbell (1)
Edited by Peter Børgesen 、John E. Sanchez、Jr. 、Paul H. Townsend 、Timothy P. Weihs (1)
Edited by Peter Børgesen 、Kenneth A. Jackson 、Robert C. Sundahl 、King-Ning Tu (1)
Edited by Peter Børgesen 、Klavs F. Jensen 、Roger A. Pollak (1)
Edited by Shefford P. Baker 、Peter Børgesen 、Caroline A. Ross 、Paul H. Townsend 、Cynthia A. Volkert (1)

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CAMBRIDGE UNIVERSITY PRESS (4)
Cambridge University Press (2)

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Beam-Solid Interactions::Physical Phenomena:VOLUME157
90折

1.Beam-Solid Interactions::Physical Phenomena:VOLUME157

作者:Edited by James A. Knapp ; Peter Børgesen ; Raymond A. Zuhr  出版社:Cambridge University Press  出版日:1990/07/13 裝訂:平裝
Papers from the symposium, held in Boston, Nov./Dec. 1989, are devoted to both fundamental and applied research on ion, laser, and electron beam modification and deposition of materials, with particul
定價:1845 元, 優惠價:9 1661
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Electronic Packaging Materials Science VII:VOLUME323
90折

2.Electronic Packaging Materials Science VII:VOLUME323

作者:Edited by Peter Børgesen ; Klavs F. Jensen ; Roger A. Pollak  出版社:Cambridge University Press  出版日:1994/03/21 裝訂:平裝
Proceedings of the symposium held at the MRS 1993 Fall Meeting in Boston. The symposium dealt with materials science related to the development of electronic packaging, and the proceedings focus on fi
定價:1845 元, 優惠價:9 1661
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Thin Films:Stresses and Mechanical Properties IV:VOLUME308
滿額折

3.Thin Films:Stresses and Mechanical Properties IV:VOLUME308

作者:Edited by Peter Børgesen ; John E. Sanchez; Jr. ; Paul H. Townsend ; Timothy P. Weihs  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1993/10/27 裝訂:平裝
Proceedings of the title symposium, held at the 1993 Spring Meeting of the MRS in San Francisco. The papers are arranged in nine sections following the topical outline upon which the symposium was org
定價:1665 元, 優惠價:9 1499
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Thin Films:Stresses and Mechanical Properties V:VOLUME356
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4.Thin Films:Stresses and Mechanical Properties V:VOLUME356

Papers presented at the title symposium, held at the 1994 Fall Meeting of the MRS. The topics of the six invited papers: stress and its effect on intermixing in Si 1 - xGe x/Si superlattices; aspects
定價:1665 元, 優惠價:9 1499
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Electronic Packaging Materials Science VIII:VOLUME390
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5.Electronic Packaging Materials Science VIII:VOLUME390

作者:Edited by Peter Børgesen ; Kenneth A. Jackson ; Robert C. Sundahl ; King-Ning Tu  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1995/09/26 裝訂:平裝
The April 1995 symposium, held as part of the MRS Spring Meeting in San Francisco, emphasized materials research and development and processing issues identified in The National Technology Roadmap fo
定價:1665 元, 優惠價:9 1499
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Materials Reliability in Microelectronics IV:VOLUME338
滿額折

6.Materials Reliability in Microelectronics IV:VOLUME338

Proceedings from the Materials Research Society symposium held in San Francisco, April 1994. Invited and contributed papers cover oxides, thin films, experimental techniques, stress in semiconductors
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)

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