TOP
0
0
【簡體曬書節】 單本79折,5本7折,優惠只到5/31,點擊此處看更多!

縮小範圍


商品類型

原文書 (3)
商品狀況

可訂購商品 (3)
庫存狀況

無庫存 (3)
商品定價

$800以上 (3)
出版日期

2016年以前 (3)
裝訂方式

平裝 (1)
作者

Duane S. Boning (EDT)/ Katia Devriendt (EDT)/ Michael R. Oliver (EDT)/ David J. Stein (EDT)/ Ingrid Vos (EDT) (1)
Edited by Duane S. Boning 、Johann W. Bartha 、Ara Philipossian 、Greg Shinn 、Ingrid Vos (1)
Edited by Duane S. Boning 、Katia Devriendt 、Michael R. Oliver 、David J. Stein 、Ingrid Vos (1)
出版社/品牌

CAMBRIDGE UNIVERSITY PRESS (2)
Cambridge Univ Pr (1)

三民網路書店 / 搜尋結果

3筆商品,1/1頁
Chemical-Mechanical Planarization:VOLUME767
滿額折
作者:Edited by Duane S. Boning ; Katia Devriendt ; Michael R. Oliver ; David J. Stein ; Ingrid Vos  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:2003/08/27 裝訂:平裝
The fabrication technology for advanced integrated circuits, affectionately known as CMP, continues to find application in novel devices at the same time that understanding is growing about the physic
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Advances in Chemical-Mechanical Polishing:VOLUME816
滿額折
作者:Edited by Duane S. Boning ; Johann W. Bartha ; Ara Philipossian ; Greg Shinn ; Ingrid Vos  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:2005/03/21 裝訂:平裝
Already in widespread use in integrated circuit fabrication, chemical-mechanical polishing is beginning to appear in a wider range of applications. This work contains 37 papers originally presented at
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Chemical-Mechanical Planarization
滿額折
定價:1575 元, 優惠價:9 1418
無庫存,下單後進貨(到貨天數約30-45天)

暢銷榜

客服中心

收藏

會員專區