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繁體書（1）

原文書（6）

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無庫存（7）

商品定價

$800以上（7）

出版日期

2020~2021 （2）

2016~2017 （1）

2016年以前（4）

裝訂方式

平裝（2）

精裝（5）

作者

Cher Ming (Chang Gung University Tan Taiwan and Director of Centre of Reliability Science and Technology),Preetpal (Center for Reliability Engineering Singh Ming Chi University of Technology Taiwan) （1）

Cher Ming Tan （1）

Cher Ming Tan (EDT)/ Thong Ngee Goh (EDT) （1）

Cher Ming Tan/ Feifei He （1）

Cher Ming Tan/ Zhenghao Gan/ Wei Li/ Yuejin Hou （1）

出版社/品牌

Springer Verlag （4）

Elsevier Science Publishing Co Inc （1）

Jenny Stanford Pub （1）

World Scientific Pub Co Inc （1）

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共7筆商品，1/1頁

Graphene and VLSI Interconnects

作者：Cher-Ming Tan 出版社：Jenny Stanford Pub 出版日：2021/11/25 裝訂：精裝

無法訂購

若需訂購本書，請電洽客服
02-25006600[分機130、131]。

滿額折

Electromigration in ULSI Interconnections

作者：Cher Ming Tan 出版社：World Scientific Pub Co Inc 出版日：2010/12/30 裝訂：精裝

Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration

定價：3570 元，優惠價：9 3213

無庫存，下單後進貨(採購期約4~10個工作天)

Electromigration Modeling at Circuit Layout Level

作者：Cher Ming Tan; Feifei He 出版社：Springer Verlag 出版日：2013/05/04 裝訂：平裝

Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect

定價：3150 元，優惠價：1 3150

無庫存，下單後進貨(到貨天數約30-45天)

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

作者：Cher Ming Tan; Zhenghao Gan; Wei Li; Yuejin Hou 出版社：Springer Verlag 出版日：2011/03/07 裝訂：精裝

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interco

無法訂購

若需訂購本書，請電洽客服
02-25006600[分機130、131]。

Theory and Practice of Quality and Reliability Engineering in Asia Industry

作者：Cher Ming Tan (EDT); Thong Ngee Goh (EDT) 出版社：Springer Verlag 出版日：2017/01/26 裝訂：精裝

This book discusses the application of quality and reliability engineering in Asian industries, and offers information for multinational companies (MNC) looking to transfer some of their operation and

無法訂購

若需訂購本書，請電洽客服
02-25006600[分機130、131]。

Future Learning in Primary Schools ― A Singapore Perspective

作者：Ching Sing Chai (EDT); Cher Ping Lim (EDT); Chun Ming Tan (EDT) 出版社：Springer Verlag 出版日：2015/10/19 裝訂：精裝

This edited book tells the story of the multifaceted efforts devoted by a “future school” in Singapore—The Nan Chiau Primary School—in shaping future learning. It documents the various measures implem

無法訂購

若需訂購本書，請電洽客服
02-25006600[分機130、131]。

Reliability and Failure Analysis of High Power LED Packaging

作者：Cher Ming (Chang Gung University Tan Taiwan and Director of Centre of Reliability Science and Technology); Preetpal (Center for Reliability Engineering Singh Ming Chi University of Technology Taiwan) 出版社：Elsevier Science Publishing Co Inc 出版日：2021/11/01 裝訂：平裝

無法訂購

若需訂購本書，請電洽客服
02-25006600[分機130、131]。

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搜尋條件

Graphene and VLSI Interconnects

Electromigration in ULSI Interconnections

Electromigration Modeling at Circuit Layout Level

Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections

Theory and Practice of Quality and Reliability Engineering in Asia Industry

Future Learning in Primary Schools ― A Singapore Perspective

Reliability and Failure Analysis of High Power LED Packaging