Electromigration in ULSI Interconnections
商品資訊
定價
:NT$ 3570 元優惠價
:90 折 3213 元
領券後再享88折起
領
團購優惠券A
8本以上且滿1500元
再享89折,單本省下353元
再享89折,單本省下353元
領
無庫存,下單後進貨(採購期約4~10個工作天)
可得紅利積點:96 點
相關商品
商品簡介
商品簡介
Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
主題書展
更多
主題書展
更多書展本週66折
您曾經瀏覽過的商品
購物須知
為了保護您的權益,「三民網路書店」提供會員七日商品鑑賞期(收到商品為起始日)。
若要辦理退貨,請在商品鑑賞期內寄回,且商品必須是全新狀態與完整包裝(商品、附件、發票、隨貨贈品等)否則恕不接受退貨。