Electronic packaging is a subset of engineering concerned with the protection and reliability of electrical circuits. This is an overview of problems and challenges facing an engineer working with the
This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications.
Three experienced antenna engineers, two of whom teach at Azusa Pacific University, describe the application of the systems engineering method to the realization of phased array systems and subsys
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developme
