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魅麗。花火原創小說66折起

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2016年以前 (3)

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Edited by Paul S. Ho 、Kenneth A. Jackson 、Che-Yu Li 、G. Ferris Lipscomb (1)
Edited by Peter Børgesen 、Kenneth A. Jackson 、Robert C. Sundahl 、King-Ning Tu (1)
Edited by Ralph Jaccodine 、Kenneth A. Jackson 、Edwin D. Lillie 、Robert C. Sundahl (1)

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CAMBRIDGE UNIVERSITY PRESS (2)
Cambridge University Press (1)

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Electronic Packaging Materials Science VI:VOLUME264
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1.Electronic Packaging Materials Science VI:VOLUME264

作者:Edited by Paul S. Ho ; Kenneth A. Jackson ; Che-Yu Li ; G. Ferris Lipscomb  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1992/11/12 裝訂:平裝
Proceedings of the symposium held April 27-30, 1992 in San Francisco, Calif., on polymers for multichip module packaging interconnects their system and technology, materials and processing, their ther
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Electronic Packaging Materials Science VIII:VOLUME390
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2.Electronic Packaging Materials Science VIII:VOLUME390

作者:Edited by Peter Børgesen ; Kenneth A. Jackson ; Robert C. Sundahl ; King-Ning Tu  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1995/09/26 裝訂:平裝
The April 1995 symposium, held as part of the MRS Spring Meeting in San Francisco, emphasized materials research and development and processing issues identified in The National Technology Roadmap fo
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Electronic Packaging Materials Science IV:VOLUME154
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3.Electronic Packaging Materials Science IV:VOLUME154

作者:Edited by Ralph Jaccodine ; Kenneth A. Jackson ; Edwin D. Lillie ; Robert C. Sundahl  出版社:Cambridge University Press  出版日:1989/12/06 裝訂:平裝
Symposium held April 1989, San Diego, California. Emphasis is on the fundamental materials and processing problems encountered in the packaging of VLSI and VHSIC devices, and their interconnection int
定價:1845 元, 優惠價:9 1661
無庫存,下單後進貨(到貨天數約30-45天)

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