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【簡體曬書區】 單本79折,5本7折,活動好評延長至5/31,趕緊把握這一波!

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2016年以前 (4)

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Edited by Edwin D. Lillie 、Paul S. Ho 、Ralph Jaccodine 、Kenneth Jackson (1)
Edited by Janice L. Veteran 、David L. O'Meara 、Veena Misra 、Paul S. Ho (1)
Edited by Kenneth P. Rodbell 、William F. Filter 、Harold J. Frost 、Paul S. Ho (1)
Edited by Paul S. Ho 、Kenneth A. Jackson 、Che-Yu Li 、G. Ferris Lipscomb (1)

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CAMBRIDGE UNIVERSITY PRESS (4)

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Materials Reliability in Microelectronics III:VOLUME309
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1.Materials Reliability in Microelectronics III:VOLUME309

作者:Edited by Kenneth P. Rodbell ; William F. Filter ; Harold J. Frost ; Paul S. Ho  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1993/08/31 裝訂:平裝
The proceedings of the title symposium, held in San Francisco in April 1993, comprise invited and contributed papers in the areas of dielectric reliability; microstructure effects on reliability; stre
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)
Silicon Materials–Processing, Characterization and Reliability:VOLUME716
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2.Silicon Materials–Processing, Characterization and Reliability:VOLUME716

作者:Edited by Janice L. Veteran ; David L. O'Meara ; Veena Misra ; Paul S. Ho  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:2002/10/11 裝訂:平裝
Representing Symposium B at the April 2002 MRS Spring meeting, some 100 papers (roughly half of the total presented) address all facets of silicon processing except for junction formation, which was c
定價:1665 元, 優惠價:9 1499
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Electronic Packaging Materials Science V:VOLUME203
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3.Electronic Packaging Materials Science V:VOLUME203

作者:Edited by Edwin D. Lillie ; Paul S. Ho ; Ralph Jaccodine ; Kenneth Jackson  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1991/06/07 裝訂:平裝
Papers presented at the MRS Symposium held in Boston, November 1990, in the areas of mechanical and deformation properties of polymer interfaces, protective coatings for ICs, measurement of material p
定價:1665 元, 優惠價:9 1499
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Electronic Packaging Materials Science VI:VOLUME264
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4.Electronic Packaging Materials Science VI:VOLUME264

作者:Edited by Paul S. Ho ; Kenneth A. Jackson ; Che-Yu Li ; G. Ferris Lipscomb  出版社:CAMBRIDGE UNIVERSITY PRESS  出版日:1992/11/12 裝訂:平裝
Proceedings of the symposium held April 27-30, 1992 in San Francisco, Calif., on polymers for multichip module packaging interconnects their system and technology, materials and processing, their ther
定價:1665 元, 優惠價:9 1499
無庫存,下單後進貨(到貨天數約30-45天)

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